RELYUM TSN products in the TSN/A Conference 2019 in Frankfurt

//RELYUM TSN products in the TSN/A Conference 2019 in Frankfurt

RELYUM TSN products in the TSN/A Conference 2019 in Frankfurt

Next 8 – 9  October, System-on-Chip engineering (SoC-e) will be participating in the TSN/A Conference 2019 as silver sponsor and speaker. We are happy to announce that two of the selected conferences are presenting different TSN use case for Automotive and Industrial sector, based on RELYUM TSN products:

  • Redundant Interoperable TSN implementation for CNC Milling Machines Networking on the Aeronautics Advanced Manufacturing Center
  • DDS over TSN to Support NATO Generic Vehicle Architecture (NGVA) for Land Systems

If you want to discover more about the available TSN solutions, meet SoC-e engineers at the exhibitor booth!

By | 2019-07-22T15:16:48+02:00 July 22nd, 2019|Relyum|0 Comments

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